What are the classifications of electroplating gold

       Common types of electroplating gold on the market are: acid/neutral thin gold (commonly known as water gold, soft gold, pure gold) and acid/neutral thick gold, and thick gold includes: thin gold plating, thick gold plating, gold plating Wear-resistant gold. Although the gold electroplating process is mature, there are still some manufacturers due to the improper selection of the gold electroplating product series, which makes it difficult to meet the quality requirements, and often presents some quality problems (such as poor thickness, no wear resistance, no resistance to salt spray test) , Not resistant to nitric acid vapor test, uneven distribution, oxidative discoloration, gold rejection, pinhole, blackening and color difference, etc.).
 
       It is also important to choose nickel sulfate or nickel sulfamate plating solution before gold electroplating. The appearance of gold electroplating requires that the nickel plating layer be matte, the appearance of the plating layer is high, or the internal stress of the plating layer is low. The electroplating gold surface requires salt spray test, low internal stress of the coating and good small hole weldability, etc., nickel sulfamate semi-bright nickel brightener can be used; electroplating gold surface requires high wear resistance. Or direct nickel plating on the single and double-sided large copper foil surface through pretreatment. For single and double-sided panels without special requirements, the nickel layer can be uniformly bright in a short time. Nickel sulfate high-speed nickel brightener is better (brightness can be The quality requirements are achieved by controlling the amount of addition, and the single and double panels are generally plated with thin gold or thick gold).
 
       Plating gold classification:
 
       Thin gold: The gold-plated layer on the layout is 24K pure gold, which has excellent electrical conductivity and solderability. The coating is uniform and detailed, with high purity and low internal stress. This product is suitable for bonding. The thickness of the coating is 0.01~0.05μm.
 
       Thick gold: The content of alloy elements in the layout is less than or equal to 0.2%. It is used for special purposes such as high stability, high reliability, low touch resistance, wear resistance, corrosion resistance and good weldability. Thin and thick gold plating (0.1~0.5μm);.
 
       Thick gold plating (0.5~5μm).
 
       Electroplating gold is divided into thin gold and thick gold. Thin gold does not have high quality requirements for thick gold. Thin gold basic printed board manufacturers can do and meet the requirements, but what about thick gold? According to product performance requirements, high-frequency boards are often Not many manufacturers on the market can do it well.